In the realm of modern electronic display technology, LED displays have carved out a niche for themselves due to their high brightness, clarity, and longevity. These attributes have made them a staple in various applications such as digital signage, stage backdrops, and interior decoration. A pivotal aspect of LED display manufacturing is the encapsulation process, with Surface Mount Device (SMD) and Chip on Board (COB) technologies emerging as the dominant methods. This article delves into the intricacies of these two technologies, highlighting their differences, advantages, and disadvantages.